Description

Description:

Thermal Grizzly Minus Pad Extreme is the ideal choice for applications where thermal paste is not an option due to unwieldy application. This is especially useful where distances between the heat source and the heat sink need to be bridged – for example on memory chips and voltage converters. The thermal pad is silicone-based with modelling clay-like consistency.

This allows for an ideal surface shaping with maximum possible compression. The thermal conductivity was improved by about 260 % over the Minus Pad 8 which allows the best performance for tough cooling operations such as voltage regulators and memory ICs.

The Minus Pad Extreme is available in different sizes and thicknesses – here 100 x 100 x 0.5 mm. The pads already work excellently with very low contact pressure, and the thermal conductivity is only slightly influenced by the thickness. The choice of thickness here should therefore depend wholly on the gap to be bridged. The Minus Pad Extreme is electrically insulating. Due to the consistency, only one-time use is recommended.