Description

Description:

The heat spreader of T-FORCE DARK Z series is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. 

ENHANCED HEAT DISSIPATION

With superconductivity – thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the DARK Z memory can offer the finest and smoothest gaming experience and an extreme performance without any lag.

SELECTED IC CHIPS STABLE AND DURABLE

Every IC chip made for TEAMGROUP’s T-FORCE DARK Z DDR4 gaming memory is selected through a rigorous testing process. Every memory stick is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.

Features:

• Armor design for perfect protection
• Aluminum alloy heat sink with high performance
• High thermal conductive adhesive
• Supports Intel & AMD motherboards
• Selected high-quality IC
• Supports XMP2.0
• Energy saving with ultra-low working voltage

Specifications